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Home > Products > Engineering Adhesives > Epoxy Adhesives > EL-1061AO

EL-1061AO

Download TDS     | Application Tips     | Video

5min cure epoxy system for bonding and potting

Applications
  • EL-1061AO is a fast curing epoxy system originally formulated for electronic potting applications.
  • Due to its ability of withstand cryogenic temperatures,it can be used for applications that undergo extreme low temperatures.
Replaces
Available pack size50ml,400ml,Bulk
StandardsASTM, RoHS, REACH
Related Accessories
(Click image to explore more)

Specifications

Chemical CompositionEpoxy resin
Mixing Ratio by Volume1 : 1
ColorLight Grey
Recommended substratesMetals, Ferrite, Ceramic, Glass, Concrete and Plastics.
Pot Life5-7min
Full Cure time12 - 18 hours
Shear Strength>1800 psi
Hardness>70 Shore D
Service Temperature-269°C to 120°C

Features and Benefits

5min pot life
Excellent dimensional stability
Withstands cryogenic temperatures.

Notes

  • This is a multipurpose product for bonding,potting and encapsulation applications.
  • Available in convenient 50ml dual cartridges

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