EL-1061AO
5min cure epoxy system for bonding and potting
| Applications |
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| Replaces |     |
| Available pack size | 50ml,400ml,Bulk |
| Standards | ASTM, RoHS, REACH |
| Related Accessories (Click image to explore more) |     |
Specifications
| Chemical Composition | Epoxy resin |
| Mixing Ratio by Volume | 1 : 1 |
| Color | Light Grey |
| Recommended substrates | Metals, Ferrite, Ceramic, Glass, Concrete and Plastics. |
| Pot Life | 5-7min |
| Full Cure time | 12 - 18 hours |
| Shear Strength | >1800 psi |
| Hardness | >70 Shore D |
| Service Temperature | -269°C to 120°C |
Features and Benefits
| 5min pot life | |
| Excellent dimensional stability | |
| Withstands cryogenic temperatures. |
Notes
- This is a multipurpose product for bonding,potting and encapsulation applications.
- Available in convenient 50ml dual cartridges
Applications
EL-1061AO Rapid cure epoxy compound for electronic component potting and bonding applications
EL1061 is low viscosity, self levelling, rapid curing epoxy adhesive, suitable for bonding and potting applications in electronic components. Product availability in dual cartridge system, ensures the consistency of mixing and eliminates the hassles involved in manual mixing.
