EL-1061F
5min cure potting epoxy
| Applications |
|
| Replaces |     |
| Available pack size | 50ml,400ml,Bulk |
| Standards | RoHS |
| Related Accessories (Click image to explore more) |     |
Specifications
| Chemical Composition | Epoxy |
| Curing Mechanism | Polymerization mixing of Resin & Hardner. |
| Mixing Ratio by Volume | 1 : 1 |
| Color | Clear/Black |
| Recommended substrates | Wood , metal , ceramics , glass , composite. |
| Pot Life | 5 - 7 minutes |
| Full Cure time | 12 - 18 hours |
| Max gap fill | It can fill large gaps. |
| Shear Strength | > 2,100 psi |
| Hardness | > 70 Shore D |
| Service Temperature | -269.15°C to +120°C |
Features and Benefits
| EL-1061F cures rapidly in 5minutes and develops tenacious bond strength. | |
| Fully transparent bondline and self levelling. | |
| Minimal shrinkage upon cure and very good chemical resistance properties. | |
| Offers serviceable temperature range of 4K (- 269.15°C) to +120°C. |
Notes
- Useful for prototyping and repair situations, where faster cure is desirable.
- Product is available both in bulk and small cartridge
Applications
How to use EL 1061F for potting and encapsulation applications
EL-1061F is a two component 5minute curing epoxy system suitable for potting, bonding and sealing applications. It has an easy 1:1 (Part A: Part B) mix ratio by weight or volume. The product is transparent, self levelling and cures in about 15-20 minutes after application. Upon polymerization EL-1061F offers superior electrical insulation.
