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Home > Products > Engineering Adhesives > Epoxy Adhesives > EL-1061F

EL-1061F

Download TDS     | Application Tips     | Video

5min cure potting epoxy

5 min curing epoxy system suitable for potting, bonding, sealing applications; Suitable for bonding metals, plastics, composites, ceramics
Applications
  • EL-1061F is originally developed for potting of electronic components in various devices such as water filter control, submersible pumps, CCTV camera, auto electronic and many more. It is also widely used for bonding applications where low viscosity is required.
Replaces
Available pack size50ml,400ml,Bulk
StandardsRoHS
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Specifications

Chemical CompositionEpoxy
Curing MechanismPolymerization mixing of Resin & Hardner.
Mixing Ratio by Volume1 : 1
ColorClear/Black
Recommended substratesWood , metal , ceramics , glass , composite.
Pot Life5 - 7 minutes
Full Cure time12 - 18 hours
Max gap fillIt can fill large gaps.
Shear Strength > 2,100 psi
Hardness> 70 Shore D
Service Temperature-269.15°C to +120°C

Features and Benefits

EL-1061F cures rapidly in 5minutes and develops tenacious bond strength.
Fully transparent bondline and self levelling.
Minimal shrinkage upon cure and very good chemical resistance properties.
Offers serviceable temperature range of 4K (- 269.15°C) to +120°C.

Notes

  • Useful for prototyping and repair situations, where faster cure is desirable.
  • Product is available both in bulk and small cartridge

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