Self levelling, flexible sealant for electronic potting.
Specifications
Chemical Composition | MS Polymer |
Curing Mechanism | Moisture |
Color | Grey |
Specific Gravity | 1.5 |
Recommended substrates | Metals,Plastics,Composites,Ceramic. |
Max gap fill | 6mm |
Tack Free Time | 10-20min |
Elongation at Break | 100-170% |
Hardness | 40-50 Shore A |
Shear Strength | 0.5-1.5 MPa |
Service Temperature | -50 to +100 °C |
Features and Benefits
It exhibits very powerful initial grab |
Very low emission |
Bonds well to a wide variety of substrates without the need for special pre-treatments |
Free of isocyanate, solvent and phthalate |